Adhesive Application Engineer for Semiconductor

What makes you a good fit

• Bachelor’s degree in Materials Science/Engineering, Electronic Engineering, Chemical Engineering, or a related field
  
• Minimum seven (7) years of experience in semiconductor LCM, FOWLP, or a technical customer interface environment
  
• Deep understanding of the latest data‑center memory and 2.xD packaging trends, with strong data analysis skills
  
• Excellent interpersonal skills, including effective one‑on‑one communication with colleagues and customers, strong facilitation skills in group environments, and the ability to work independently or multitask as part of a team
  
• Ability to provide on‑site support and successfully manage complex customer issues
  
• Strong sense of responsibility and ownership, with a commitment to completing projects and consistently delivering high‑quality results grounded in a customer‑centric mindset and strong understanding of customer needs and culture
  
• Ability to draw strong conclusions and recommend clear paths forward based on project outcomes
  
• Native‑level Korean proficiency and intermediate or higher English proficiency

Some perks of joining Henkel

• Flexible work scheme with flexible hours, hybrid work model, and work from anywhere policy for up to 30 days per year
• Diverse national and international growth opportunities
• Global wellbeing standards with health and preventive care programs
• Gender-neutral parental leave for a minimum of 8 weeks
• Employee Share Plan with voluntary investment and Henkel matching shares
• Retirement Pension DC
• Support for Employee Contributions of National Health Insurance
• Support for Medical Check-up
• Flexible commuting time

At Henkel, we come from a broad range of backgrounds, perspectives, and life experiences. We believe the uniqueness of all our employees is the power in us. Become part of the team and bring your uniqueness to us! We welcome all applications across different genders, origins, cultures, religions, sexual orientations, disabilities, and generations.